$660 (full), $450 (student). The registration fee includes, in addition to full meeting access, the Sunday evening pre-conference social event, the Monday evening awards banquet, an informal Tuesday lunch at the meeting and a download version of the full conference proceedings. One day registration is available ($250/day) and includes one social event but not access to the conference proceedings. To register, please click the "Register" button on the website homepage. If you prefer a non-web-based version, a pdf of the registration form may be downloaded here in due course. You may also purchase extra tickets for the social events if you intend to bring a non-registered accompanying person/s.
Dress for the meeting and evening special events is casual.
The official language of the conference is English.
To submit an abstract, please click the "Conference Tools" button on the website homepage (https://www.sffsymposium.org/). The abstract submission deadline is April 15.
A poster session is set for late Tuesday afternoon. To participate, please submit an abstract and check the poster button. Specific information respecting poster set-up may be found here.
The Hilton Hotel is providing complimentary in-room internet service for attendees making reservations on the conference block of rooms. Complimentary wireless internet is available on the meeting floors at the conference space.
The conference program will be available at this website by late June.
Freeform and Additive Manufacturing Excellence (FAME) Awards will be given at the 2022 meeting. Information, including eligibility, selection criteria and nomination/application forms, may be found under "FAME Awards" on the website homepage. The deadline for package submission for preferred consideration is May 1.
2022 MEETING NSF STUDENT AWARDS
The National Science Foundation (NSF) has recommended funding for student support. Based on this and the timing of the meeting, we are initiating the application process now. In the unlikely event that NSF funding is not provided, no registration fee waivers will be awarded. A final funding announcement will be made here once we know.
Please note the following:
1. Awards will directly cover the full student registration fee. Award winners will pay no registration fee to attend the full meeting.
2. Before applying, please note that to qualify for the award students MUST (no exceptions, so please don’t ask) be a student at a US institution of higher learning, MUST attend the entire conference (Monday‐Wednesday) and MUST be an author or co-author on an oral or poster presentation. The abstract submission deadline is past, but student award applicants may submit an abstract (poster presentation only) along with their application for a travel award to meet this requirement. If selected for a travel award, the abstract will also be accepted.
3. “Student” means an undergraduate or graduate student currently enrolled in a US institution of higher learning. Postdoctoral scholars are not eligible.
4. Awardees are responsible for the cost of their own accommodation and transportation.
5. The number of awards is limited, and organizers reserve the right to limit the number of award recipients per university or per faculty advisor to fairly distribute the funds among institutions across the nation.
6. To be eligible for an award, students must download, complete and submit the application form.
7. Application deadline is Wednesday, May 25 by 5:00 PM CDT. You should be informed of acceptance by Monday, June 6.
8. Priority for selection will be given to applicants who are lead authors and/or who actually present the oral or poster presentation. Presentation of NSF-sponsored research is also positive.
REQUEST A VISA LETTER
To request an official visa invitation letter for this conference, please send your request to MtgServ@tms.org. Letters will be generated as requested, so you can submit it along with other required documentation to the appropriate Consulate/Embassy. Please note that this letter does not guarantee you will be granted a visa. If you need additional assistance please call at 1–724–776–9000, ext. 241.
Authors must present their work at the meeting to have their manuscript included in the proceedings. Manuscript submission is optional for presenters. Manuscript instructions may be obtained here. Manuscripts should be uploaded at the conference website. Please click the "Conference Tools" button on the website homepage. Authors submitting manuscripts have the option to have their manuscript reviewed/refereed. Having a conference proceedings article reviewed is important to some authors, particularly academicians. Each manuscript receives two reviews using a referee pool composed of all authors submitting reviewed manuscripts. Authors selecting reviewed status for their manuscript must review two other manuscripts. Please see the conference main homepage for deadlines. Reviews are due at the conference; final manuscripts are due August 26.
Authors must present their work at the meeting to have their manuscript included in the proceedings. Papers presented in presentation and poster sessions will be published in a downloadable format. Each person (including students) registering for the full meeting will receive instructions to download the full proceedings about 4 months after the meeting. Individual proceedings papers will be accessible to anyone and will be downloadable on line at the conference website. Past Proceedings articles are available at the conference website homepage. Click the "Proceedings Archive" tab under "More".
SPECIAL WORKSHOP: Early-Stage Design for Additive Manufacturing
Wednesday Morning, July 27
Lead: Dr. Nicholas Meisel, Assistant Professor of Engineering Design, Penn State
Additive manufacturing (AM) benefits from a range of design tools (e.g., topology optimization, lattice structure generation) during the later stages of design intended to improve part quality. However, how can we as engineers change our thinking generate with more ideal design candidates for AM earlier in the design process? In this special, hands-on workshop session, attendees will explore different tools for considering design for additive manufacturing (DfAM) in early-stage design. Special emphasis will be placed on the role of DfAM in concept generation. Through this workshop, participants will also be challenged to confront their own subconscious consideration of manufacturability throughout the design process. Participants from both academia and industry are encouraged to attend.
Special session on wire-fed DED
Andrzej Nycz, Oakridge National Laboratory, email@example.com
Sneha Narra, Carnegie Mellon University
Bishal Silwal, Georgia Southern University
Wire-fed metal AM has significant potential to revolutionize the way large-scale parts are fabricated. The objective of this special session is to accelerate and disseminate research activity in wire-fed AM particularly wire-arc additive manufacturing (WAAM) and wire-laser additive manufacturing (WLAM). All types of power sources including laser, welding arc, and electron beam will be considered. Participants are invited to present research and development in wire-fed additive manufacturing related topics such as process development (hardware and software), tool path planning, new material deposition, computational modeling, multi-wire deposition, surface features, and microstructure. All research areas of wire-fed AM will be considered in this special session. To participate, please check the appropriate subject box when submitting your abstract.
Special session on Data Analytics in AM
Prahalada Rao, University of Nebraska-Lincoln, firstname.lastname@example.org
Brian Giera, Lawrence Livermore National Laboratory
Subhrajit Roychowdhury, GE Global Research, Niskayuna, NY
There is a burgeoning need to integrate in-process sensing and data analytics to overcome the process repeatability and part quality-related challenges in Additive Manufacturing (AM). These research thrusts are rooted in the analysis of high volume, variety and velocity of data with concomitant challenges from the domain of Big Data analytics. Accordingly, this special SFF session on Data Analytics in AM seeks papers in the following broadly defined areas:
Sensor fusion and data analytics for In-process quality assurance
Online process monitoring and defect mitigation
Machine learning and deep learning for flaw detection
Physics-driven machine learning, Explicit AI, Scientific machine learning
Digital Twin of Additive Manufacturing
Sensor-based process-machine interaction modeling
Post-process data-driven, non-destructive metrology and measurement
Point cloud analysis
In-process materials characterization and processing
Challenges and advances in data acquisition, storage, curation, and cross-correlation with materials data
Edge computing for AM process analysis
Special session on Binder Jet Additive Manufacturing: materials, modeling, and experiments
C. Fred Higgs III, Rice University, email@example.com
Nathan Crane, Brigham Young University
Chao Ma, Texas A&M University
The reduced cost and build times associated with binder jet AM, among other advantages, have attracted recent interest from a multitude of industries that require complex and high-performance part production. However, much work remains to elucidate the physics of binder jetting, characterize the key processes in binder jetting (e.g., spreading, printing, sintering, etc.), predict printing performance, and to improve the mechanical properties of printed components before they are widely adopted for end-use. Consequently, this session requests papers investigating the following topics related to binder jet AM:
Improving porosity, dimensional accuracy, surface roughness, and other performance properties
Optimization of input parameters in spreading, binding, sintering/infiltration, and post-processing stages
Physics-based modeling and experimental validation
Fluid-particle interaction between binder and powder
Shrinkage and distortion during sintering and/or liquid metal infiltration
New and exotic materials
Novel binder chemistries
Effects of environmental conditions on the process
Artificial Intelligence (AI) in binder jetting
Emerging technologies in binder jetting
Dave Bourell, Chair - The University of Texas at Austin
Joe Beaman - The University of Texas at Austin
Rich Crawford - The University of Texas at Austin
Desiderio Kovar - The University of Texas at Austin
Carolyn Seepersad - The University of Texas at Austin
Jack Beuth - Carnegie Mellon University
Denis Cormier - Rochester Institute of Technology
Phill Dickens - Nottingham University
Chad Duty - University of Tennessee
Brian Giera - Lawrence Livermore National Lab
Richard Hague - University of Nottingham
Ola Harrysson - North Carolina State University
Carl Hauser - TWI Technology Centre
Neil Hopkinson - XAAR
Bradley Jared - Sandia National Labs
Brandon Lane - NIST
Ming Leu - Missouri University of Science & Technology
Frank Liou - Missouri University of Science & Technology
Toshiki Niino - The University of Tokyo
David Rosen - Georgia Institute of Technology
Tom Starr - University of Louisville
Brent Stucker - ANSYS
Ryan Wicker - The University of Texas at El Paso
Chris Williams - Virginia Tech