$725 (full), $500 (student). The registration fee includes, in addition to full meeting access, the Sunday evening pre-conference social event, the Monday evening awards banquet, an informal Tuesday lunch at the meeting and a download version of the full conference proceedings. One day registration is available ($275/day) and includes one social event but not access to the conference proceedings. To register, please click the "Register" button on the website homepage. If you prefer a non-web-based version, a pdf of the registration form may be downloaded here in due course. You may also purchase extra tickets for the social events if you intend to bring a non-registered accompanying person/s.
Dress for the meeting and evening special events is casual.
The official language of the conference is English.
ABSTRACT SUBMISSION (will be updated)
To submit an abstract, please click the "Conference Tools" button on the website homepage (https://www.sffsymposium.org/). The abstract submission deadline is April 3rd.
A poster session is set for late Tuesday afternoon. To participate, please submit an abstract and check the poster button. Specific information respecting poster set-up may be found here.
The Hilton Hotel is providing complimentary in-room internet service for attendees making reservations on the conference block of rooms. Complimentary wireless internet is available on the meeting floors at the conference space.
The conference program will be available at this website by late June.
FAME AWARDS (will be updated)
Freeform and Additive Manufacturing Excellence (FAME) Awards will be given at the 2023 meeting. Information, including eligibility, selection criteria and nomination/application forms, may be found under "FAME Awards" on the website homepage. The deadline for package submission for preferred consideration is May 1.
2022 MEETING NSF STUDENT AWARDS (will be updated for 2023)
The National Science Foundation (NSF) has recommended funding for student support. Based on this and the timing of the meeting, we are initiating the application process now. In the unlikely event that NSF funding is not provided, no registration fee waivers will be awarded. A final funding announcement will be made here once we know.
Please note the following:
1. Awards will directly cover the full student registration fee. Award winners will pay no registration fee to attend the full meeting.
2. Before applying, please note that to qualify for the award students MUST (no exceptions, so please don’t ask) be a student at a US institution of higher learning, MUST attend the entire conference (Monday‐Wednesday) and MUST be an author or co-author on an oral or poster presentation. The abstract submission deadline is past, but student award applicants may submit an abstract (poster presentation only) along with their application for a travel award to meet this requirement. If selected for a travel award, the abstract will also be accepted.
3. “Student” means an undergraduate or graduate student currently enrolled in a US institution of higher learning. Postdoctoral scholars are not eligible.
4. Awardees are responsible for the cost of their own accommodation and transportation.
5. The number of awards is limited, and organizers reserve the right to limit the number of award recipients per university or per faculty advisor to fairly distribute the funds among institutions across the nation.
6. To be eligible for an award, students must download, complete and submit the application form.
7. Application deadline is Wednesday, May 25 by 5:00 PM CDT. You should be informed of acceptance by Monday, June 6.
8. Priority for selection will be given to applicants who are lead authors and/or who actually present the oral or poster presentation. Presentation of NSF-sponsored research is also positive.
REQUEST A VISA LETTER (will be updated)
To request an official visa invitation letter for this conference, please send your request to MtgServ@tms.org. Letters will be generated as requested, so you can submit it along with other required documentation to the appropriate Consulate/Embassy. Please note that this letter does not guarantee you will be granted a visa. If you need additional assistance please call at 1–724–776–9000, ext. 241.
MANUSCRIPTS (instructions will be updated)
Authors must present their work at the meeting to have their manuscript included in the proceedings. Manuscript submission is optional for presenters. Manuscript instructions may be obtained here. Manuscripts should be uploaded at the conference website. Please click the "Conference Tools" button on the website homepage. Authors submitting manuscripts have the option to have their manuscript reviewed/refereed. Having a conference proceedings article reviewed is important to some authors, particularly academicians. Each manuscript receives two reviews using a referee pool composed of all authors submitting reviewed manuscripts. Authors selecting reviewed status for their manuscript must review two other manuscripts. Please see the conference main homepage for deadlines. Reviews are due at the conference; final manuscripts are due August 26.
Authors must present their work at the meeting to have their manuscript included in the proceedings. Papers presented in presentation and poster sessions will be published in a downloadable format. Each person (including students) registering for the full meeting will receive instructions to download the full proceedings about 4 months after the meeting. Individual proceedings papers will be accessible to anyone and will be downloadable on line at the conference website. Past Proceedings articles are available at the conference website homepage. Click the "Proceedings Archive" tab under "More".
Special session on Department of Defense Applications of Additively Manufactured Parts
Additive Manufacturing is being implemented in a variety of DOD/DOE applications. In this session, we invite presentations/papers pertaining to studies focused on leveraging the benefits of AM for applications in real environments. This session will include fundamental research of AM to direct applied DoD/DoE examples. The topics to be covered in this session may include: 1) use of AM materials unique to DOD applications 2) rigorous qual/cert acceptance criteria (building trust in AM) 3) novel testing methods; 4) design and manufacturing as they relate to DOD applications. 5) efforts to build secure and shareable libraries of DoD relevant knowledge of AM materials properties.
Special session on Dimensional and Surface Characterization for AM
For the adoption of AM to continue to accelerate, a strong understanding of the dimensional and surface characteristics of AM parts will be required. As designers and engineers continue to push the limits of complexity, users must be able to determine accuracy of fabrication and finishing techniques. With this in mind, the purpose of this symposium is to review and discuss the measurement and characterization of AM part surfaces and dimensions. Emphasis of the talks should be on the measurement and characterization methods and uncertainty. Suitable topics for this symposium include:
Dimensional accuracy and surface finish of AM technologies
Dimensional characterization of internal geometries using XCT
Designation and realization of product definitions for AM (see ASME Y14.46 Product Definition for Additive Manufacturing)
Dimensional and surface characterization for complex geometries
Use of surface and dimensional characterization as a process signature of AM equipment
Characterization of as-built and post-processed AM surfaces
Relationships of dimensional and surface characteristics to function.
Joe Beaman, Chair - The University of Texas at Austin
Rich Crawford - The University of Texas at Austin
Desiderio Kovar - The University of Texas at Austin
Carolyn Seepersad - The University of Texas at Austin
Jack Beuth - Carnegie Mellon University
Denis Cormier - Rochester Institute of Technology
Phill Dickens - Nottingham University
Chad Duty - University of Tennessee
Brian Giera - Lawrence Livermore National Lab
Richard Hague - University of Nottingham
Ola Harrysson - North Carolina State University
Carl Hauser - TWI Technology Centre
Neil Hopkinson - XAAR
Bradley Jared - Sandia National Labs
Brandon Lane - NIST
Ming Leu - Missouri University of Science & Technology
Frank Liou - Missouri University of Science & Technology
Toshiki Niino - The University of Tokyo
David Rosen - Singapore UTD
Tom Starr - University of Louisville
Brent Stucker - ANSYS
Ryan Wicker - The University of Texas at El Paso
Chris Williams - Virginia Tech